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The
MS-1000 is a highly portable microscope for exclusive use with
BGA, CSP, and QFP. The MS-1000 is highly efficient in inspecting
components which cannot be inspected by conventional X-ray inspection
systems.
It's unique design is ideally suited for inspecting fillets
of soldered balls, the melted condition of soldered parts, cracks,
defective soldering, and more. It can be used to inspect soldered
balls at a maximum magnification of 140x and a maximum height
of 0.2mm.
The MS-1000 comes complete with prism allowing the MS-1000 to
inspect the surface-mounted parts of QFPs and from an angular
position, it can be used to inspect the melted and un-melted
status of soldering.
The microscope can be connected to the PC with the USB pack
(USB2.0 connection). The MS-1000 can be powered via the PC USB
socket. A viewer software for image storing, two-point calibrating,
and a marker function is also included with the microscope.
For the complete MS1000 range and specifications click here
to download pdf. 
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| Sample Screen Views |
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BGA1
Shows the condition where the soldered ball is flaked
from the PCB. It results from the warping of the board.
This image was taken by pushing down the PCB to confirm
the warped status. |
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BGA2
You can confirm the following conditions by moving the
camera probe forward and backward:
• The
soldering state of the soldered
ball with the PCB
• The surface state of the
soldered ball
• The soldering state of the
soldered
ball with the package
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QFP
You can observe the QFP mounted parts from various angles
using the Straight Prism.
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